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Greg Walker

Greg Walker
Name: Greg Walker
Phone: 615 343 6959
Fax: 615 343 6687
Office: 335 Olin Hall
Mail: VU Box 351592 Sta B
  Nashville, TN 37235-1592 USA
  Curriculum Vitae (PDF)

Associate Professor of Mechanical Engineering


Ph.D., Mechanical Engineering, Virginia Tech -1997

M.S., Mechanical Engineering, Auburn University -1993

B.S., Mechanical Engineering, Auburn University -1990

Research Interests

micro-scale heat transfer, heat flux measurement, energy transport processes, ultrasonic pyrometry, thermographic phospors, energy conversion devices, high-performance computing

Current Projects

Thermal Physics Laboratory
Professor D. G. Walker
The Thermal Physics Lab is dedicated to scientific discovery at the frontiers of heat transfer. Current research includes investigation of new transient thermometry using thermographic phosphors, modeling and simulation of noncontinuum energy transport in microelectronic devices, quantum energy conversion devices, radiation effects in nanostructures, and novel electronics cooling technologies. All efforts are grounded in fundamental thermo-physical processes but expand the boundaries of traditional heat transfer applications.


Bulusu and D. G. Walker, `` Quantum Modeling of Thermoelectric Properties of Si/Ge/Si Superlattices,'' accepted for publication, IEEE Transactions on Electron Devices, Vol. 55, No. 1, pp. 423--429, January, 2008.

Bulusu and D.G. Walker, ``Quantum modeling of thermoelectric performance of strained Si/Ge/Si superlattices using the nonequilibrium Green's function method,'' Journal of Applied Physics, Vol. 102, No. 7, October 2007, 073713.

Bulusu and D.G. Walker, ``Modeling of thermoelectric properties of semiconductor thin films with quantum and scattering effects,'' Journal of Heat Transfer, Vol. 129, No. 4, April, 2007, pp. 492--499.

D.G. Walker and S.W. Allison, ``Transient measurements using thermographic phosphors,'' ISA Transactions, Vol. 46, January, 2007, pp. 15--20.

R.D. Harvey, D.G. Walker and K.D. Frampton, ``Enhancing performance of thermoelectric coolers through the application of distributed control,'' IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 2, June 2007, pp. 330--336.

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